56pcs 90mm BGA Reballing Stencils for Game Series Chips Gameplayer + Aluminum Alloy Reballing Station Stencil Holder

Material: stainless steel Size: 90x90mm/3.5x3.5in For 0.45MM Soler Ball (3pcs) DDR3(XBOX CACHE RAM）; AC82PM45; AC82P45 For 0.5MM Soler Ball (13 pcs) 0. 5 Universal Stencil（Pitch=0. 8MM); 1100//1150; IXP460; X1300; MCP67MV-A2//MCP77MV-A2; NF-6100-430 GFGO7400-N-A3//GFG07200; 965; QG 82945P//82945GC; QG 82945PM; QG 82945GMS; NQ82915GMS; LE82PM965 For 0.6MM Soler Ball (26pcs) GF-G06200/7200/7300/7400/7600; G05200; 4200GO; NF-4N-A3//NF4-A3; NF-430-N-A3; NF-G6150-N-A2; MX440 FXGO5200; 200M; 7500 M7/9000; 9200//9600//9700//X300//X600//X700; IXP400//IXP450; X1600/ATI X1600 M56-P RC410MB//AT1200M universal; VT8235//VT8237//VT8237A; P4M900//P4M890//CN896//VN896; 964L (964); 82801GBM; 82801HBM; 82801FBM; 82915P; 915PM/915GM/82915PM; RG82865PE (865PE); 0.6(pitch=0. 9mm)Universal Stencil; 0.6(pitch=1.0mm) Universal Stencil; 0.6(pitch=1.1mm) Universal Stencil 0.76 Universal Stencil（pitch=1.27MM）; 5855GME; 82801EB; 82801DBM/82801DB//82801CAM; AL M1671 (ALIM1671BI) 845MP/855PM (RG845MP/855PM) GAME STENCILS 0.6MM（8 pcs）XBOX 360CPU； XBOX 360GPU; XBOX 360HANA; XBOX 360CSP (XBOX 360 Southbridge); PS3-CPU (new model); PS3-GPU (old model) CPS3 CPU BALL; PS3-CXR714120//CXR714123 Package Included: 1 x Reballing Station 90mm*90mm 1 x 56pcs Stencil Models

• 90*90MM STAINLESS STEEL -- 56 PCS/Set, these stencils are made of high quality 304 stainless steel, the thickness of steel mesh is perfect, enough to meet your various needs, can be easily blown up by the hot air machine, cooperate with ordinary air gun and not easy to deform
• REBALLING STATION -- The reballing station is specially designed for laptop, desktop, communication main board north-south bridge, and graphics card, etc all kinds of BGA chips. It is easy and quickly for reballing the BGA IC, useful and economical accessories for BGA soldering
• EASY TO USE -- The specifications of BGA universal reballing stencil reballing templates set are marked on the surface, convenient for you to choose and use them on the reballing station
• PERFECT MATCH -- The area of stencil is matched with the area of BGA chip, which can reduce the waste of solder ball. TIPS: Leaded solder ball melting point 183 degrees
• WIDE RANGE OF APPLICATIONS -- The reball stencils template is suitable for BGA heavy ball general molds of desktop laptops, game consoles, etc. to be directly heated and reworked for general chip repair